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Advanced Semiconductor Engineering, Inc., together with its subsidiaries, provides semiconductor packaging and testing services for semiconductor companies. Its services include semiconductor packaging; design and production of interconnect materials; front-end engineering testing; and wafer probing and final testing services. The company offers various leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier, and quad flat no-lead package; and package types based on substrates, including flip-chip BGA and other BGA types, as well as wafer-bumping products. Its testing services comprise front-end engineering testing, wafer probing, and final testing of logic/mixed-signal and memory semiconductors, as well as other test-related services, such as burn-in testing, dry pack, and tape and reel. The company packages and tests a range of products for use in various end-use applications in communications, personal computers, consumer electronics, and industrial and automotive sectors. Advanced Semiconductor Engineering sells its products primarily in Taiwan, the United States, Asia, and Europe. The company was founded in 1984 and is based in Kaohsiung, Taiwan.

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Key Statistics

Closing Price	5.05
Volume	(mio) 2.33
Volume Avg	(mio) 1.41
52 Week High	6.34
52 Week Low	4.00
PE	14.32
PE (group average)	57
EPS Year	0.35
EPS change Q/Q	0%
EPS change Q/Q Yr ago	50%
EPS change Q/Q next Q est	-70%
EPS change Y/Y	-80%
REV change Q/Q	0%
REV change Q/Q Yr ago	-99.89%
EPS next Q est	0.10
EPS next Y est	0.00
Divident Annual	0.10
Dividend Yield	1.98%