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KLA-Tencor Corporation designs, manufactures, and markets process control and yield management systems for the semiconductor manufacturing and related nanoelectronics industries worldwide. It offers equipment comprising patterned and unpatterned wafer inspection, defect review, and classification; reticle defect inspection; packaging and interconnect inspection; critical dimension metrology; pattern overlay metrology; film thickness, surface topography, and composition measurement; measurement of in-chamber process conditions, wafer shape, and stress metrology; computational lithography tools; and yield and fab-wide data management and analysis solutions. The company provides component inspection systems for inspecting semiconductor IC packaging; wafer inspection systems for 2D and 3D inspection of semiconductor or LED wafers; and solar inspection systems to inspect photovoltaic solar wafers and solar cells during solar PV cell manufacturing. Its defect inspection tools help to detect, count, classify, and characterize yield failures caused by particles, residues, and other contaminants, as well as pattern defects, surface anomalies, and electrical issues during the stages of IC manufacturing. The company's component inspection systems inspect various components that are handled in trays; and inspect for 3D planarity, evenness of contacts, and 2D surface aspects, as well as identification marks and orientation. Its metrology, analysis, and process window optimization products verify designs that are to be manufactured, characterize new processes, and monitor manufacturing processes. KLA-Tencor also provides support services through yield management collaboration with its customers, a worldwide service department and related online tech support, as well as offers software solutions to translate inspection and metrology data into consolidated information that reveal process problems. The company was founded in 1975 and is headquartered in Milpitas, California.

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Key Statistics

Closing Price	50.65
Volume	(mio) 2.43
Volume Avg	(mio) 2.86
52 Week High	53.05
52 Week Low	33.20
PE	11.39
PE (group average)	57
EPS Year	4.44
EPS change Q/Q	12.61%
EPS change Q/Q Yr ago	278.79%
EPS change Q/Q next Q est	0.81%
EPS change Y/Y	-89.11%
REV change Q/Q	8.85%
REV change Q/Q Yr ago	74.39%
EPS next Q est	1.24
EPS next Y est	4.48
Divident Annual	1.30
Dividend Yield	2.57%