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Kulicke and Soffa Industries, Inc. designs, manufactures, and markets capital equipment and packaging materials, as well as services, maintains, repairs, and upgrades equipment, used to assemble semiconductor devices. It operates in two segments, Equipment and Packaging Materials. The Equipment segment manufactures and markets a line of ball bonders and die bonders. Ball bonders are used to connect very fine wires, primarily made of gold, aluminum, or copper, between the bond pads of the semiconductor device or die, and the leads on its package. Die bonders are used to attach a die to the package, which will house the device. The Packaging Materials segment markets a range of expendable tools for the semiconductor packaging and assembly market. Its expendable tools include various capillaries, wedges tools, clamp tooling, cutter blades, wire guides, and wafer saw blades. The company markets and sells its products primarily to large semiconductor manufacturers, semiconductor subcontract assemblers, and vertically integrated manufacturers of electronic systems principally in the United States and the Asia/Pacific region. It sells its products through direct sales force, manufacturersÂ’ representatives, and distributors. The company was founded in 1951 and is headquartered in Fort Washington, Pennsylvania.

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Key Statistics

Closing Price	11.64
Volume	456037
Volume Avg	896640
52 Week High	12.72
52 Week Low	6.71
PE	7.33
PE (group average)	57
EPS Year	1.62
EPS change Q/Q	161.9%
EPS change Q/Q Yr ago	83.33%
EPS change Q/Q next Q est	66.67%
EPS change Y/Y	-84.38%
REV change Q/Q	38.82%
REV change Q/Q Yr ago	34.4%
EPS next Q est	0.33
EPS next Y est	1.65
Divident Annual	0.00
Dividend Yield	0%